REHM CondensoXS Vac Vapor Phase Reflow Soldering System 650x650 mm PCB

High-performance REHM CondensoXS Vac vapor phase soldering system designed for precision SMT applications requiring exceptional thermal stability and oxygen-free processing. This 2014 machine utilizes Galden fluid technology to ensure uniform heat transfer and highly reliable soldering results, making it ideal for complex and high-density PCB assemblies. The system offers vacuum capability for void reduction, industrial PC control, and semi-automatic loading, ensuring repeatability and process control in demanding electronics manufacturing environments. Its robust German construction and advanced vapor phase technology make it particularly suitable for high-quality soldering where traditional convection systems may fall short.

Technical Specifications

• Manufacturer: REHM Thermal Systems
• Model: CondensoXS Vac
• Machine type: Vapor phase reflow soldering system (Vacuum)
• Year of construction: 06/2014
• Heating technology: Vapor phase (Galden fluid)
• Temperature accuracy: ±2 °C
• Maximum soldering temperature: 240 °C
• Warm-up time: 45 minutes
• Max PCB size: 650 x 650 mm
• Loading system: Semi-automatic PCB loading
• Control system: Industrial PC with dedicated software
• Cooling system: Water cooling (10–20 l/min @ 15 °C)
• Voltage: 3 x 230/400 V, 50 Hz
• Power consumption: Typical 7 kW, max 35 kW
• Compressed air: 6 bar
• Exhaust: 400 m³/h
• Dimensions: 2,522 x 1,981 x 1,750 mm (L x D x H)
• Weight: 1,900 kg

Composition / Included Equipment

• REHM CondensoXS Vac vapor phase oven
• Integrated industrial PC with monitor and keyboard
• Semi-automatic loading system
• Vacuum system for void reduction
• Cooling and exhaust systems
• Electrical cabinet with control components
• Galden-compatible process setup

Additional Information

• Condition: Used
• CE marked
• Made in Germany
• Designed for high-reliability SMT and PCB soldering processes
• Ideal for industries requiring precision soldering such as automotive electronics, aerospace, and high-end electronics manufacturing
• Excellent solution for applications requiring void-free solder joints and consistent thermal profiles

non-binding information to be verified at purchase