REHM Compact C2.1 Nitro 1.8 B Reflow Soldering Oven, 5 Heating Zones, Nitrogen/Air, 400 mm PCB Width

Compact and reliable REHM reflow soldering oven suitable for SMT production environments requiring stable thermal performance and flexible operation in both nitrogen and air. This REHM Compact C2.1 nitro 1.8 B, built in 2007, features 5 forced-convection heating zones plus a cooling zone, offering an efficient solution for PCB reflow processes with graphical PC-based control for parameter setup. The machine is designed for consistent soldering results, controlled process management, and integration into electronics manufacturing lines. Based on the available information, it is a good option for companies looking for a used reflow oven with nitrogen capability, solid German construction, and practical operating flexibility. Technical details and dimensions are available from the seller’s information

Technical Specifications

• Manufacturer: REHM
• Model: Compact C2.1 nitro 1.8 B
• Machine type: Reflow soldering oven
• Year of construction: 2007
• Heating system: 5 forced-convection heating zones + 1 cooling zone
• Soldering atmosphere: Nitrogen and air
• PCB width min.: 40 mm
• PCB width min. with central support: 25 mm
• PCB width max.: 400 mm
• PCB width max. with central support: 450 mm
• Conveyor speed: 150 - 1,500 mm/min
• User interface: Graphical PC interface for work parameter setting
• Voltage: 230 / 400 V, 50 Hz
• Power consumption max.: 30 kW
• Nitrogen consumption: 25 m³/h
• Exhaust process: 400 m³/h
• Exhaust cooling: 2,500 m³/h
• Dimensions: 1,360 x 1,600 x 3,635 mm
• Weight: 2,000 kg

Composition / Included Equipment

• REHM Compact C2.1 nitro 1.8 B reflow oven
• Integrated PC monitor and keyboard control interface
• Conveyor system
• Cooling section
• Electrical cabinet and internal control components visible on machine
• Nitrogen-capable process configuration
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Additional Information

• Condition: Used
• Location: Not specified
• CE marked
• Project number: 1865
• Suitable for SMT and PCB soldering applications requiring controlled reflow processing
• Good choice for electronics production, PCB assembly, and industrial soldering operations
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non-binding information to be verified at purchase